TAWFIK E. A. OTHMAN; MOHAMMED S. R. SALEH; KHLAD F. G. AWATH. The Effect Of Electroplating A Ni-Sic Alloy On The Hardness Of A Copper Sample . African Journal of Advanced Pure and Applied Sciences (AJAPAS), [S. l.], v. 3, n. 1, p. 292–299, 2024. Disponível em: https://aaasjournals.com/index.php/ajapas/article/view/744. Acesso em: 3 jul. 2024.