Tawfik E. A. Othman, Mohammed S. R. Saleh, and Khlad F. G. Awath. 2024. “The Effect Of Electroplating A Ni-Sic Alloy On The Hardness Of A Copper Sample”. African Journal of Advanced Pure and Applied Sciences (AJAPAS) 3 (1):292-99. https://aaasjournals.com/index.php/ajapas/article/view/744.