Tawfik E. A. Othman, Mohammed S. R. Saleh, and Khlad F. G. Awath. “The Effect Of Electroplating A Ni-Sic Alloy On The Hardness Of A Copper Sample”. African Journal of Advanced Pure and Applied Sciences (AJAPAS), vol. 3, no. 1, Mar. 2024, pp. 292-9, https://aaasjournals.com/index.php/ajapas/article/view/744.