Copper surface wettability modification by microsecond laser surface texturing

Abstract

Copper and its alloys are susceptible to deterioration in moist environments. Creating a hydrophobic surface can provide protection against these problems. Low power Nd: YAG laser marking machine with microsecond pulse durations was used in this study. It offers a more cost-effective option compared to common ultrafast laser systems. This study investigated the effects of multiple laser processing parameters on copper surface wettability to optimize the fabrication process. Contact angle measurements revealed that laser texturing significantly increased the contact angle of copper surfaces, shifting them from hydrophilic to hydrophobic. Hydrophobic copper can be valuable in applications requiring moisture resistance or water repellency.